Call for Abstracts

Workshop on Accelerated Stress Testing  AST 2000

October 2 - 4, 2000


Omni Interlocken Resort Hotel*

Boulder, Colorado

Sponsored by the IEEE

Components, Packaging and Manufacturing Technology Society (TC-7)

And Technically Cosponsored by IEEE Reliability Society

General Chair

Joe Mantz

ATT

425-702-2709

joe.mantz@attws.com


Technical Program Chair

Mark Gibbel

JPL

818-542-6979

mark.gibbel@jpl.nasa.gov


Finance

T. Paul Parker

Lucent Technologies

(972) 284 2295

tpparker@lucent.com


Exhibitor Chair

Dennis Pachucki

Compaq

408 285 5316

dennis.pachucki@compaq.com


Publicity & Registration Chair

Kirk Gray

AcceleRel Engineering, Inc.

303 666-7692

k.a.gray@ieee.org


Local Host

Simon Prakash

Cielo Communications

(303) 410-6004

sprakash@cieloinc.com


In addition to two days of technical presentations, this workshop will include a one-day tutorial from leaders in the field and a two-day exhibition featuring AST related suppliers.   

Authors are invited to submit abstracts on a variety of topics related to Accelerated Stress Testing including the following targeted topics:

Advanced Approaches to AST     

Electrodynamic vs. Repetitive Shock Vibration

Reliability Improvement Techniques     

AST Data Collection/Analysis

Failure Analysis Techniques and Examples     

Reliability Simulation and Modeling

Application of Physics of Failure Techniques   

Stress Screening Techniques

AST Case Studies, including stress profiles       

Stress other than temperature & vibration

Functional test During Stress Testing     

AST Results on New Technologies

Contributed Abstracts must be recived by April 28th, 2000.  Notification of acceptance will be provided by June 15th, 2000.  All appropriate company and government clearances must be obtained prior to submission.  Authors should submit their abstracts by the above date to the technical program chair via Email. Submissions should not exceed one page and should be submitted in a file format compatible with MS Word (WordPerfect, text, etc).   Abstract title, author names, affiliations, phone number, mailing, and email addresses should begin each Abstract. A final copy of their manuscript or viewfoils is to be submitted by August 1st 2000.  Your viewgraph presentation only will be printed in the proceedings. Three hardcopies of your final (camera ready) presentation package should be submitted in addition to a MS PowerPoint file.  Overhead, slide, VGA (computer projection) and VCR facilities will be available for presenters.

Tutorial Topics Include:

Device fabrication and failure modes

Functional testing during AST

SMT PWB fabrication and failure modes

Design verification testing and AST

AST techniques and technologies

AST cost analysis

AST success stories

Alternative AST technologies and techniques

AST shortcomings

AST data collection and analysis

Vibration and thermal theory relevant to AST

Application of Physics of Failure techniques

 

 

 

A Block of  rooms has been reserved at the Omni Interlocken Resort Hotel at a discounted price of $109.00 per night for a single room and $119.00 for a double room for the days of the conference. Please Specify the "IEEE Accelerated Stress Test"  Reservations can be reached by phone (303) 438-6600.

For addition information, please contact one of the individuals shown on the left.

 

 

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