1st IEEE/CPMT 2-day Workshop on
Accelerated Stress Testing
SEPTEMBER 7-8, 1995
at Tandem Computers, Inc
Sponsored by the
Santa Clara Valley chapter of the
Components, Packaging, & Manufacturing Technology (CPMT) Society
of the Institute of Electrical and Electronics Engineers (IEEE);
CPMT's TC-7 on Accelerated Life Testing;
and the Santa Clara Valley Chapter of IES.
FOR MORE INFORMATION:
IEEE Home Page
CPMT Home Page
The Workshop Program
More on TC-7
Accelerated Stress Testing (AST)
has become an accepted practice in
a number of companies seeking the highest quality products. "Best
practices" are now circulating as models upon which other industrial
companies can build. This local Workshop, held in the Santa Clara
Valley, will be a forum for sharing novel and useful AST techniques
and results within the computer and communications fields for
subsystems (peripherals, terminals, power supplies) and systems
(workstations, computers, central office equipment). We invite your
TECHNICAL PRESENTATIONS: talks by technologists actively involved
in accelerated stress testing.
PANEL DISCUSSIONS: interactive discussions of immediate needs, problem
areas, concerns and innovative solutions that constitute Best Practices.
TOURS Walk-throughs and presentations at two local corporate
accelerated testing labs -- Tandem Computers, and Sun Microsystems.
SHARING: Meeting technical professionals in the accelerated testing
field in an intimate, open environment.
WORKSHOP BOOKLET OF EXTENDED ABSTRACTS: Each attendee will receive
a booklet containing extended abstracts of the presentations.
LIMITED ATTENDANCE: Participation will be limited to 75 individuals
from the pool of applicants. Presentors are assured admission,
although co-authors may not be. If the Workshop is oversubscribed, then
professionals in non-AST fields may need to be declined acceptance,
and limits may be placed on the number of participants from each
THURSDAY, September 7, 1995
7:30 - 8:15 AM: Registration, with coffee and rolls
8:15 - Welcome: Paul Wesling, Tandem Computers, and CPMT Society
Vice President, Publications
8:20 -- Keynote Talk: "Overview of Accelerated Stress Testing",
Dr. Tony Chan, AT&T Bell Labs, Workshop Chair
- 8:45 - 10:15 -- Session 1: Modern Approaches to AST
- "A New Set of Guidelines for Environmental Stressing",
Francoise Sandroff, Duncan Culver, Aridaman Jain, Theodore
Shankoff, Bellcore (Red Bank, NJ)
Bellcore has developed a new set of guidelines, which will
be presented; a cost/benefit model will be described, and
two cost/benefit examples will be presented.
- "Maintaining Quality with ESS", Alfred Sugarman, Octel Corp.
Stress testing on printed circuit assemblies is being done to
assure field reliability. In-circuit testing is performed
before and after stressing to evaluate effectiveness. EST is
also preformed at the system level, but with some limitations
required by certain assemblies.
- Panel: "Approaches to AST", with discussion
- (coffee break: 10:15 - 10:30)
- 10:30 - Noon -- Session 2: Vibration
- "High Frequency Vibration (5kHz - 10kHz) in ESS", Gil Bastien,
Screening Systems, Inc.
Higher frequencies are not considered in most stress
testing since most failures occur at lower or intermediate
frequencies. This paper explores the higher frequencies
and the effects on components and surface flaws.
- "Vibration Modeling and Analysis", Edmond Kyser, Tandem Computers
- "Random Pheumatic Hammer for ESS Applications", John Hess,
Storage Technology Corporation (Louisville, Colorado)
- (no-host lunch: Noon - 1:30)
- 1:30 - 2:45 -- Session 3: AST Case Studies
- "Configuring ESS for Quick-to-Market Products", Cheryl Ascarrunz,
Edmond Kyser, Tandem Computers
Development and release programs can be shortened by
reviewing screening histories of similar products, testing
prototype assemblies, and using step stress to failure tests
to confirm mechanisms. An example will be described of
application of this quicker process.
- "Space Applications of Systems Approach to Environmental Testing,"
Stephen Cornford, Mark Gibbel, JPL
- (coffee break: 2:45 - 3:00)
- 3:00 - 4:30: Demonstration of LabView software and its use in the lab;
Tour of Tandem Computers' AST labs
- 6:00 - 8:00 PM: Dinner meeting, hosted by
IEEE Technical Committee
on Accerated Stress Testing (TC-7) -- Tony Chan, TC-7 Chair
- FRIDAY, September 8, 1995
- 8:30 - 10:00 AM -- Session 4: Reliability Improvement
- "Reliability and Yield Growth and Cost Savings Through EST/ESS
Process Control and Corrective Actions -- A Case Study",
Kunal Roy, Hughes Network Systems (San Diego)
It was found that both EST during design and ESS during
early manufacturing were required; small sample sizes
during development resulted in no failures, while doing
ESS during manufacturing found latent problems.
- "Statistical Inferences and Analysis of an ESS Program",
David Christiansen, Edmond Kyser, Tandem Computers
A screening program was begun in the second quarter of
shipments of a new product, allowing comparison of screened
and unscreened populations. Results are analyzed
statistically to assess theeffectvieness of this reliability
- "Environmental Test Effectiveness", Mark Gibbel, JPL
- (coffee break: 10:00 - 10:15)
- 10:15 - 11:45 AM -- Open Forum
- Short talks by attendees, each from 5 to 10 minutes in length.
If you have practices or observations to share, bring one or
two viewgraphs and solicit comment and feedback from the Workshop
attendees. Potential questions you can address:
- Testing approaches that have proved successful in my company
- Case Studies: how we did it, what was done, results
- What are the challenges over the next 3 to 5 years?
- If budget weren't an issue, what would I do?
- What types of products will we be testing in 3 to 5 years?
- What sort of professional sharing would assist us?
- 1:30 - 3:00: Tour of Sun Microsystems' AST labs in Mountain View
(tentative -- map provided)
Chair: Anthony Chan, Ph.D., AT&T Bell Laboratories, Princeton
Technical Program: Edmond Kyser, Ph.D., Tandem Computers, Inc.
Finance: David Llewelyn, LTX Corporation
Anthony Chan, Ph.D., AT&T Bell Laboratories (TC-7 Chair)
David Horsma, Ph.D., Raychem Corp.
Harry McLean, Qualmark
Dennis Pachucki, Tandem Computers, Inc.
To receive additional printed copies of the Advance Program and application
for participation for this Workshop,
send your name, mailing address, and internet email address
(if available) to the registrar, below.
TC-7: TECHNICAL COMMITTEE ON ENVIRONMENTAL
STRESS AND RELIABILITY TESTING
Chaired by Dr. Tony Chan of AT&T Bell Laboratories, this committee
was established to assist professionals involved in assuring that
their electronic system hardware is robust and meets world-class
standards for design quality. Interest is from the chip package level
up to fully assembled large systems, with a special emphasis on the
use of environmental stress testing as a means of qualifying and
systematically improving product reliability. Members share
techniques for product qualification, simulation, environmental
testing, and other aspects of assuring that a product is mature enough
for market. Membership includes technologists from around the world.
You need not be an IEEE member to be a member of TC-7. To be added
to the mailing list for the TC-7 Newsletter, contact the chairman at
+1-609-639-2420 (or via email at email@example.com).
All Workshop attendees are invited to attend the autumn meeting of
this TC, held during the Workshop's Thursday evening dinner; indicate
your interest on the registration form, above.
/ August 28, 1995